Number of SMT lines: 12 high-speed SMT chip mounting supporting production lines

SMT daily production capacity: over 20 million points

Testing equipment: X-RAY detector, first article tester, AOI automatic optical detector, ICT tester, BGA repair bench

Mounting speed: CHIP component mounting speed (under optimal conditions) 0.036 S/piece

Minimum packaging that can be pasted: 0201, with an accuracy of ± 0.04mm

Minimum device accuracy: capable of mounting devices such as PLCC, QFP, BGA, CSP, etc., with pin spacing of ± 0.04mm

IC chip mounting accuracy: It has a high level of accuracy for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. High difficulty products such as TFT display driver board, mobile phone motherboard, battery protection circuit, etc. that can be mounted/inserted/mixed